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Design of an Inductive Plug-Socket Pair Using Silicon Laminated Steel Core

Abstract— One of the common electrical related accidents at home is electric shock due to misuse and mishandling of electrical plugs and sockets. This study presents the concept of a device that would somehow lessen the cases of electrocution among children, adolescents and adults. It aims to design an inductive plugsocket pair prototype in advancement to the existing conductive plug-socket pair. In the construction proper, considerations were focused on the size of the laminated silicon core and turns-ratio. To determine the characteristic of the prototype, measurement of the core and copper losses using no-load and short-circuit tests, respectively, as well as the computation of voltage regulation and efficiency of the prototype were done. The study came up with the size of the cores as 0.75 in x 0.75 in for the socket and 0.5 in x 0.5 in for the plug and number of turns as 2200 turns for the socket and 4400 turns for the plug. Performing no-load and shortcircuit tests, the equivalent resistance and reactance of the inductive plug-socket pair were determined to be 47.2590 Ω and 144.6495 Ω respectively. Last but not the least, the efficiency and voltage regulation of the prototype were 61.85% and 31.42%, respectively, which showed as proof of concept of the feasibility of an inductive plug-socket pair device to be used for small appliances.

Index Terms— electrical plug, inductive plug-socket pair, laminated steel core.

Conrado F. Ostia, Jr, Carlos Marcelo A. Alvarez, Jerome L. Ani, Ross Albert S. Sangalang, Emmanuel Joseph J. Santiago, Jesus M. Martinez Jr.
School of Electrical, Electronics and Computer Engineering, Mapúa University, PHILIPPINES

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Cite: Conrado F. Ostia, Jr, Carlos Marcelo A. Alvarez, Jerome L. Ani, Ross Albert S. Sangalang, Emmanuel Joseph J. Santiago, Jesus M. Martinez Jr., "Design of an Inductive Plug-Socket Pair Using Silicon Laminated Steel Core," Proceedings of 2019 the 9th International Workshop on Computer Science and Engineering, pp. 858-862, Hong Kong, 15-17 June, 2019.